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건실하고 믿음직한 기업, 동서라인텍에 오신걸 환영합니다.

Automotive

관리자 2016-04-29 13:11:56 조회수 1,707
Nickel, Boric acid and Cl? in Nickel sulphamate plating                   Hydrofluoric acid (0.3-1-3-5%) solutions                                        Peroxide and Sulphuric acid in Acid Etch                                         Tin and H2SO4 in stannous tin plating Tin, Lead and free acid in Tin/Lead solder plating Iron, Nickel in Permalloy plating Copper, H2SO4 and Cl? in Copper sulphate plating NaOH in developer Potassiumcarbonate / bicarbonate in developer TMAH (Tetra-methyl ammoniumhydroxide) in organic developer HF in Ferric chloride etchant HF in Microetch Mixed acid Etchants (HCl / HF, HNO3 / HF / HAc) NaOH in Photo resist stripper HCl or H3PO4 in Acid Sump KOH in Caustic Sump H2O2 in Wafer clean process NH4OH in Wafer clean process AL 7 AL 55 AL 57      
이전글
Mining
다음글
Steel-Metal/Galvanic