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건실하고 믿음직한 기업, 동서라인텍에 오신걸 환영합니다.

Automotive

관리자 2016-04-29 13:11:56 조회수 1,658
Nickel, Boric acid and Cl? in Nickel sulphamate plating                  
Hydrofluoric acid (0.3-1-3-5%) solutions                                       
Peroxide and Sulphuric acid in Acid Etch                                        
Tin and H2SO4 in stannous tin plating
Tin, Lead and free acid in Tin/Lead solder plating
Iron, Nickel in Permalloy plating
Copper, H
2SO4 and Cl? in Copper sulphate plating
NaOH in developer
Potassiumcarbonate / bicarbonate in developer
TMAH (Tetra-methyl ammoniumhydroxide) in organic developer
HF in Ferric chloride etchant
HF in Microetch
Mixed acid Etchants (HCl / HF, HNO
3 / HF / HAc)
NaOH in Photo resist stripper
HCl or H
3PO4 in Acid Sump
KOH in Caustic Sump
H
2O2 in Wafer clean process
NH
4OH in Wafer clean process
AL 7
AL 55
AL 57
 
 
 
이전글
Mining
다음글
Steel-Metal/Galvanic