- Boric acid [B(OH)3] in Nickel [NiCl2] electroplating bath

- Chromium [Cr3+] in Chromic acid [H2Cr2O4] electroplatingbath

- Caustic [NaOH] in Electrolytic clean, Nitric Acid[HNO3], Hydrofluoric acid [HF] + Neutralizer in Etching baths

- Caustic [NaOH], Nitric acid [HNO3], + Ammoniumbifluoride [NH4HF2] in Etching baths

- Sulfuric acid [H2SO4], Phosphoric bcid [H3PO4], TotalIron [Fe2+ / Fe3+], + Hydrochloric bcid [HCl]

- Acid [Free and total], Fluoride [F-], Zinc [Zn2+], +Accelerator

- Acid [Free and total], Nitrite [NO2-], + Zinc [Zn2+]

- Fluoride [F-] in Surface treatment bath

- Sulfuric acid [H2SO4] + Zinc [Zn2+]