- Free and Total acid in Etching bath

- Free and Total acid + Ortho-Phosphate [P-PO4] inEtching bath

- Chloride [Cl-] in Etching bath

- Phosphoric acid [H3PO4] in Etching bath

- Hydrofluoric acid [HF], Nitric acid [HNO3], + Sulfuricacid [H2SO4] in Etching bath

- Nitric acid [HNO3], Sulfurous Acid [H2SO3], + HydrofluoricAcid [HF] in Etching

- Oxalic acid [H2C2O4] in Etching process

- Sulfuric acid [H2SO4] + Hydrogen Fluoride [HF] inProcess

- Hydrogen fluoride [HF], HydroChloric Acid [HCl] +Potassium Hydroxide [KOH] in Etching bath

- Hydrogen fluoride [HF], Hexafluorosilicic acid [H2SiF6],Nitric Acid [HNO3], + Acetic Acid [CH3COOH]

- Hydrofluoric Acid [HF] + Nitric acid [HNO3] inEtching bath

- Isopropyl alcohol [C3H8O] + Sodium hydroxide [NaOH]in Etching bath

- Total acid in Etching baths

- Acidity in Etching baths

- Copper [Cu2+], Sulfuric acid [H2SO4], + Chloride [Cl-]in Etching bath

- Fluoride [F-] in Strong acids

- Hydrochloricacid [HCl] & Nitricacid [HNO3] + pH in etching baths

- Hydrofluoric acid [HF] + Hydrochloric acid [HCl]

- Hydrogen peroxide [H2O2] + Hydrochloric acid [HCl] inEtching

- Iron [Fe2+], Nickel [Ni2+], + Copper [Cu2+] in Etching bath

- Tin [Sn2+] + Free acid in Tin plating baths

- pH + Amines

- Tetramethylammonium hydroxide [TMAH] inDeveloper

- Copper [Cu2+] in Plating

- EDTA in Cu bath

- Nickel [Ni2+] + Phosphoric acid [H3PO4]

- Phosphate [P-PO43-] and Sulfite [SO32-] in Plating bath